MOL-5F-2D clean oven
Published:
2023-07-27
Scope of application: Suitable for electronic components, touch screen, LCD, camera module dispensing, post-printing curing and IC, IGBT and other semiconductor devices after packaging baking.
Inner size: W1200mm×D800mm×H600mm*2(single box size)
External size: W1760mm×D1600mm×H1850mm (machine reference size)
Materials and standards:
1. Inner barrel: imported SUS304#800 times 1.2mm thick mirror stainless steel plate, and clean by alkaline soda water, to avoid oil pollution to avoid PARTICLE production during baking.
2. The exterior adopts SS41# 1.2mm cold-rolled steel plate after anti-rust treatment, powder baking paint, wrinkle white
3. Adopt 120K advanced thermal insulation cotton, and the thickness of insulation layer is 90 mm.
4. Adopt high temperature packing, temperature resistance ≥260℃.
5. Solenoid door lock, adjustable American rear twist.
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