MOL-5F-2D clean oven
Published:
2023-07-27
Scope of application: Suitable for electronic components, touch screen, LCD, camera module dispensing, post-printing curing and IC, IGBT and other semiconductor devices after packaging baking.
Inner size: W1200mm×D800mm×H600mm*2(single box size)
External size: W1760mm×D1600mm×H1850mm (machine reference size)
Materials and standards:
1. Inner barrel: imported SUS304#800 times 1.2mm thick mirror stainless steel plate, and clean by alkaline soda water, to avoid oil pollution to avoid PARTICLE production during baking.
2. The exterior adopts SS41# 1.2mm cold-rolled steel plate after anti-rust treatment, powder baking paint, wrinkle white
3. Adopt 120K advanced thermal insulation cotton, and the thickness of insulation layer is 90 mm.
4. Adopt high temperature packing, temperature resistance ≥260℃.
5. Solenoid door lock, adjustable American rear twist.
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Dongguan Xinzhou Industrial Equipment Co., Ltd
Tel：0769-85649377 / 85641686
Phone：13826979389(Mr. Zhao)
Email：huawei.zhao@dgxinzhou.com
Address: No. 393, Chang'an Section, Tai'an Road, Chang'an Town, Dongguan City, Guangdong Province
Hubei Xinhai Industrial Intelligent Equipment Co., Ltd
Tel：0710-4901388 / 4903697
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Email：annie@dgxinzhou.com
Address: Xinhai Industry, Yicheng Economic Development Zone, Xiangyang City, Hubei Province
Suzhou Xinhaiyue Intelligent Equipment Co., Ltd
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Email：henryzhao@csailtech.com
Address: Room 1210.1211, 12th Floor, Building 2, No. 1155 Baodai West Road, Gusu District, Suzhou City, Jiangsu Province
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