The role of non oxidizing oven in the process of electron beam evaporation polyimide (PI) coating

Electron beam evaporation is a high vacuum coating technology that can prepare coatings of metals, alloys, ceramics, and other materials on various surfaces, with high film formation rate and excellent coating quality. More and more researchers are applying electron beam evaporation technology to surface modification of polyimide materials to improve their adhesion with other materials. Using high-speed electron flow to concentrate and heat a certain point of the film material, causing its temperature to rise and sublimate and deposit on the substrate. This technology avoids the problem of direct contact between the film material and the vapor deposition raw material in traditional vapor deposition technology, which can easily cause mutual mixing, as well as the problem of some film materials being unable to be deposited by vacuum thermal vapor deposition due to their high melting points.

Polyimide (PI) is a high-performance polymer material with excellent properties such as high temperature resistance, insulation, and corrosion resistance. It is widely used in aerospace, electronic information, biomedicine, and other fields. Due to the hydrophobicity, oleophobicity, and chemical stability of the surface of polyimide materials, their adhesion to other materials is poor, which limits their application range. Improving the adhesion of polyimide material surfaces is one of the current research focuses.

The MOL series anaerobic oven is a special baking equipment that can maintain a low oxygen environment during the baking process to prevent material oxidation. This oven is mainly used for baking materials that are prone to react with oxygen at high temperatures, such as PI materials. Anaerobic ovens have many advantages, such as improving product quality, protecting materials from gasification, and increasing production efficiency. In the PI baking industry, non oxidizing ovens are widely used in various processes such as curing, drying, testing, aging, annealing, etc. Suitable for high-temperature treatment such as non oxidative drying, curing, welding, annealing, etc. in semiconductors, optoelectronic components, energy raw materials, communication products, electromechanical products, etc; Packaging testing; Pre curing, hardening, silver paste curing, post mold curing, electroplating annealing of organic polymer films in photolithography process; Substrate moisture removal, wafer drying and annealing, etc.

The PI baking process is commonly used in industries such as semiconductor manufacturing, COB packaging, healthcare, flexible circuit board printing, and precision mold annealing. In these industries, anaerobic ovens are widely used for special process requirements such as PI, BCB, LCP curing baking, photoresist curing, and electronic ceramic material drying.

During the PI baking process, the anaerobic oven mainly plays the following roles:
1. Preventing oxidation: PI materials are prone to oxidation at high temperatures, leading to deterioration of material properties. The use of an anaerobic oven can effectively prevent oxidation reactions from occurring. Inject nitrogen into the anaerobic oven to eliminate oxygen, thereby protecting the PI material from oxidation and ensuring its stability and reliability in performance;
2. Improve baking effect: The anaerobic oven has good temperature control ability and uniform temperature distribution. It adopts one-way horizontal air transportation, strong pressure air supply in the air ducts on both sides, and high-density punched air plates on both sides of the air ducts. The angle of the guide plate is precisely controlled to ensure temperature uniformity inside the box. This enables the PI material to be uniformly heated during the baking process, thereby improving the baking effect. The uniformity of temperature helps to reduce the stress and deformation inside PI materials, ensuring their shape stability and dimensional accuracy;
3. Reduce pollution risk: Airless ovens can effectively reduce the entry of impurities and pollutants. The interior of the anaerobic oven is made of stainless steel structure, and the box is continuously filled with nitrogen to keep the working chamber in a low oxygen and clean state.

During the preparation process of PI materials, some impurities and pollutants can have adverse effects on the material properties. By using an anaerobic oven, it is possible to reduce the entry of pollutants from the outside air into the baking environment, thereby reducing the risk of pollution.
4. Improve production efficiency: Anaerobic ovens have the ability to quickly heat up and cool down, thereby improving production efficiency. Compared to traditional baking methods, airless ovens can heat PI materials to the desired temperature and restore them to room temperature faster. This reduces the production cycle, improves production efficiency, and avoids oxidation of high-temperature door opening products;

The anaerobic oven plays a crucial role in the PI baking process. Not only can it protect PI materials from oxidation, improve curing effect and production efficiency, but it can also reduce pollution risks. By using anaerobic ovens reasonably, the quality and performance of PI materials can be ensured, meeting the demand for high-quality products in the electronic manufacturing industry and improving production efficiency.