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Product Type
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Hot Air Circulation Tunnel Drying Machine Oven for IC semiconductor
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Model No.
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HTMF-471-36
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Power Supply
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AC(380±38)V 30KVA (50±0.5)Hz
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Internal Size(mm)
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1. High temperature heating furnace:L800*W600*H530mm
2. Pipe for Bismuth solution: dia50mm
3. Forming part: L400*W300*H300mm
4. Cooling part: L1200*W600*H300mm
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External Size(mm)
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W2202mm*L3446mm*H2321mm for reference
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Internal Material
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SUS316# stainless steel sheet, fully sealed
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External Material
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SUS304# stainless steel sheet
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Heating Insulation Material
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200 mm, high quality insulation cotton
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Temp. Range
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Max:500℃
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Temp. Accuracy
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±0.3%FS
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Temp. Rise Time
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about 60 min from normal to 450 °C
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Temp. Controller
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7 inch touch screen + PLC + LED digital display+PID
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Heat Circuit Control
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SSR control
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Heating method
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nickel alloy heating exchanger
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Ambient Condition
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Relative humidity ≤ 85%RH, pressure 86～106kpa
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Safety Device
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All the electronic components meet international safety standards
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Warranty
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1 year
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Remark: All our products can be customized by the clients' demand.
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